Thermal Conductive Sheet - 企業ランキング(全5社)
更新日: 集計期間:Sep 17, 2025〜Oct 14, 2025
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企業情報を表示
会社名 | 代表製品 | ||
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製品画像・製品名・価格帯 | 概要 | 用途/実績例 | |
Model number: WW-TGA6200 Dimensions: 30mm × 30mm × thickness 0.5mm Thermal conductivity: 6.2 W/m·K Flame retardancy: V-0 UL-94 Diele... | ● Thermal management of heat-generating components in electronic and electrical devices. ● Heat dissipation measures for CPUs and ICs. ●... | ||
Model number: WW-TGA1450 Thermal conductivity: 14.5 W/m・K (ASTM D5470) Size: 30mm × 30mm × thickness 0.5mm Hardness: 60 shore00 Dens... | - For cooling the CPU of a computer and the GPU of a graphics card - Ideal for cooling Intel Socket LGA115x CPUs. | ||
Model number: WW-TGA4500-804005 Thermal conductivity: 4.5W/m・K (ASTM D5470) Base polymer: Silicone Size: 80mm × 40mm × thickness 0.5mm... | - Thermal management of heating components in electronic and electrical devices. - Thermal management of CPUs and ICs. - Thermal management ... | ||
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- 代表製品
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T-Global high thermal conductivity sheet thermal conductivity 6.2 W/m·K
- 概要
- Model number: WW-TGA6200 Dimensions: 30mm × 30mm × thickness 0.5mm Thermal conductivity: 6.2 W/m·K Flame retardancy: V-0 UL-94 Diele...
- 用途/実績例
- ● Thermal management of heat-generating components in electronic and electrical devices. ● Heat dissipation measures for CPUs and ICs. ●...
T-Global's ultra-high thermal conductivity heat dissipation sheet with a thermal conductivity of 14.5 W/m·K.
- 概要
- Model number: WW-TGA1450 Thermal conductivity: 14.5 W/m・K (ASTM D5470) Size: 30mm × 30mm × thickness 0.5mm Hardness: 60 shore00 Dens...
- 用途/実績例
- - For cooling the CPU of a computer and the GPU of a graphics card - Ideal for cooling Intel Socket LGA115x CPUs.
T-Global ultra-high thermal conductivity sheet with a thermal conductivity of 4.5 W/m·K
- 概要
- Model number: WW-TGA4500-804005 Thermal conductivity: 4.5W/m・K (ASTM D5470) Base polymer: Silicone Size: 80mm × 40mm × thickness 0.5mm...
- 用途/実績例
- - Thermal management of heating components in electronic and electrical devices. - Thermal management of CPUs and ICs. - Thermal management ...
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